Our record in MLB manufacturing is 22 layers — and we regularly fabricate intricate 18 and 20 layer boards with both blind via and buried via for elite defence projects.
From Teflon composites to flexi-rigid multilayers, we handle the PCB technologies that most manufacturers cannot.
Sophisticated 16 and 18 layered boards with both blind via and buried via, manufactured for elite defence projects requiring maximum routing density.
High-frequency Teflon-based PCBs for RF and microwave applications, including composite multilayers combining Teflon, Ceramic, and standard FR4.
A proprietary process for 6-layer composite multilayers in Teflon, Ceramic and FR4 combination — with testing completed on 10–12 layer Teflon Composite Multilayers.
Copper-Invar-Copper metal core PCBs delivering superior thermal conductivity and controlled thermal expansion for power electronics.
High-temperature polyimide multilayers built for environments where standard FR4 materials cannot withstand sustained thermal and mechanical stress.
Multi-layered boards with precision edge plating for enhanced grounding, EMI shielding, and connector-free edge connections.
Combined flexible and rigid sections in a single multilayer assembly — enabling 3D packaging and reducing connector count in space-constrained designs.
Blind and buried via Teflon composite antennas manufactured for IIT Chennai, IIT Delhi, and IIT Jodhpur — contributing to almost a dozen PhD research papers.
The world's most powerful Anodized Aluminium Bonding process — with bond strength exceeding several times that of plated copper on epoxy.
This technology can make the difference between success and failure of the board during high temperatures. Bond strength exceeds several times that of plated copper on epoxy.
We are the only manufacturers of such boards in India.
Our record in multi-layer PCB manufacturing is 22 layers. We regularly fabricate 18 and 20 layer boards with both blind via and buried via for defence and aerospace projects.
AL-Back is our proprietary Anodized Aluminium Bonding technology — the world's most powerful process for bonding anodized aluminium to PCB substrates. Bond strength exceeds several times that of plated copper on epoxy, making it critical for boards that must survive extreme thermal stress in automotive, military, aerospace, medical, and high-power applications. Fortran Cirkit is the only manufacturer of AL-Back boards in India.
Yes. We manufacture Teflon-based PCBs for RF and microwave applications, including a proprietary process for Teflon composite multilayers — 6-layer boards combining Teflon, ceramic, and FR4 in a single stack-up. We have also completed testing on 10–12 layer Teflon composite multilayers, and we manufacture blind and buried via Teflon composite antennas for IIT Chennai, IIT Delhi, and IIT Jodhpur.
Fortran Cirkit holds ISO 9001:2000 quality management certification and is LCSO certified. Our manufacturing processes and quality systems meet the rigorous requirements of ISRO, Bharat Electronics, DRDO, and other defence and aerospace clients.